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Measuring fluid velocity in electronic enclosures
Thermal analysis and characterization of electronic systems requires a knowledge of fluid velocity. In pursuit of this information, we often resort to measurement or calculation. The issue of...
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Thermal analysis moves into the 21st century
In the last decade, we’ve come a long way in the application of thermal analysis to the design of electronics. And there’s no sign of the pace of innovation changing. Engineers are still being...
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Characterizing a package on a populated printed circuit board
This column has emphasized methods of analyzing packages in the JEDEC-standard test environment. A thermal metric that lends itself to analyses of system applications is the junction-to-board thermal...
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Simple Formulas for Estimating Thermal Spreading Resistance
A problem commonly encountered in the thermal analysis of electronic packages is that of thermal spreading resistance. Thermal spreading resistance occurs as heat flows by conduction between a source...
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Use of Power Law Regression in Packaging Thermal Calculations
Introduction In today’s demanding business climate, thermal engineers are often called upon to produce thermal analyses rapidly. For example, there is frequently the need for a quick calculation of a...
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IC Package Thermal Characterization Made Easy
FloTHERM® IC is a new Web-based tool from Mentor Graphics that incorporates a high level of automation for key tasks related to semiconductor thermal characterization and design. Developed with the...
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The Uses of Simplicity in Thermal Analysis
Bruce Guenin, PhD Editor-in-Chief, Summer 2010 Issue The dramatic trajectory of Moore’s law has produced a number of changes in key areas of technology that are critical to our industry: 1) greater...
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Energy Management Software Helps Data Centers Conserve Energy
Power IQ 2.0 Energy Management software provides Thermal Analytics for monitoring rack temperatures based on industry guidelines. Trending reports and cumulative totals can be displayed at the data...
View ArticleMeasuring fluid velocity in electronic enclosures
Thermal analysis and characterization of electronic systems requires a knowledge of fluid velocity. In pursuit of this information, we often resort to measurement or calculation. The issue of...
View ArticleThermal analysis moves into the 21st century
In the last decade, we’ve come a long way in the application of thermal analysis to the design of electronics. And there’s no sign of the pace of innovation changing. Engineers are still being...
View ArticleCharacterizing a package on a populated printed circuit board
This column has emphasized methods of analyzing packages in the JEDEC-standard test environment. A thermal metric that lends itself to analyses of system applications is the junction-to-board thermal...
View ArticleSimple Formulas for Estimating Thermal Spreading Resistance
A problem commonly encountered in the thermal analysis of electronic packages is that of thermal spreading resistance. Thermal spreading resistance occurs as heat flows by conduction between a source...
View ArticleIC Package Thermal Characterization Made Easy
FloTHERM® IC is a new Web-based tool from Mentor Graphics that incorporates a high level of automation for key tasks related to semiconductor thermal characterization and design. Developed with the...
View ArticleThe Uses of Simplicity in Thermal Analysis
Bruce Guenin, PhD Editor-in-Chief, Summer 2010 Issue The dramatic trajectory of Moore’s law has produced a number of changes in key areas of technology that are critical to our industry: 1) greater...
View ArticleEnergy Management Software Helps Data Centers Conserve Energy
Power IQ 2.0 Energy Management software provides Thermal Analytics for monitoring rack temperatures based on industry guidelines. Trending reports and cumulative totals can be displayed at the data...
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